SERVICE MANUAL
FM/AM CASSETTE CAR STEREO
US Model
Model Name Using Similar Mechanism
XR-C5100
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-C7350X
2
TABLE OF CONTENTS
1. SERVICE NOTE ............................................................. 2
2. GENERAL ........................................................................ 3
3. DISASSEMBLY .............................................................. 8
4. ASSEMBLY OF MECHANISM DECK ................ 9
5. MECHANICAL ADJUSTMENTS ............................ 12
6. ELECTRICAL ADJUSTMENTS
6-1. Test Mode ........................................................................ 12
· Tape Deck Section ........................................................ 12
· Tuner Section ................................................................ 12
7.
DIAGRAMS
7-1. Block Diagrams
· TUNER/TAPE/MAIN Section ..................................... 13
· DISPLAY/KEY CONTROL/BUS CONTROL/
POWER SUPPLY Section ........................................... 14
7-2. Schematic Diagram PRE OUT Board ...................... 15
7-3. Printed Wiring Board PRE OUT Board .................. 15
7-4. Printed Wiring Board MAIN Board ......................... 16
7-5. Schematic Diagram MAIN Board (1/2) ................... 17
7-6. Schematic Diagram MAIN Board (2/2) ................... 18
7-7. Printed Wiring Boards KEY/SUB Boards .............. 19
7-8. Schematic Diagrams KEY/SUB Boards .................. 20
7-9. IC Block Diagrams ......................................................... 21
7-10. IC Pin Function ............................................................... 22
8.
EXPLODED VIEWS ................................................ 25
9.
ELECTRICAL PARTS LIST ............................... 28
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SECTION 1
SERVICE NOTE
SUB board
Front panel assembly
Please press on the sub board from above when checking it.
This assures that the connector does not lose contact.
3
SECTION
2
GENERAL
This
section
is
extracted
from
instruction
manual.
4
5