MICROFILM
SERVICE MANUAL
FM/MW/SW CASSETTE CAR STEREO
E Model
Model Name Using Similar Mechanism
XR-C5100
Tape Transport Mechanism Type
MG-25F-136
SPECIFICATIONS
XR-C5200
2
TABLE OF CONTENTS
1.
GENERAL
Location of Controls .......................................................
3
Resetting the Unit ...........................................................
4
Detaching the Front Panel ...............................................
4
Setting the Clock .............................................................
4
Installation .......................................................................
5
Connections .....................................................................
6
2.
DISASSEMBLY ......................................................... 9
3.
ASSEMBLY OF MECHANISM DECK ........... 10
4.
MECHANICAL ADJUSTMENTS ....................... 13
5.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 13
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 14
6.
DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 17
6-2. Printed Wiring Board MAIN Board ......................... 19
6-3. Schematic Diagram MAIN Board (1/2) ................... 21
6-4. Schematic Diagram MAIN Board (2/2) ................... 23
6-5. Printed Wiring Board KEY Board ........................... 25
6-6. Schematic Diagram KEY Board .............................. 27
6-7. IC Pin Function Description ........................................... 31
7.
EXPLODED VIEWS ................................................ 34
8.
ELECTRICAL PARTS LIST ............................... 37
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
3
SECTION 1
GENERAL
This section is extracted from
instruction manual.
4
5