MICROFILM
SERVICE MANUAL
AEP Model
UK Model
E Model
XR-1800
East European Model
XR-1803
Saudi Arabia Model
XR-1804
Model Name Using Similar Mechanism
NEW
Tape Transport Mechanism Type
MG-36SZ9-32
SPECIFICATIONS
XR-1800/1803/1804
Photo: XR-1804
Continued on next page
XR-1800: AEP, UK Model/XR-1803
FM/MW/LW CASSETTE CAR STEREO
XR-1800: E Model
FM/AM CASSETTE CAR STEREO
XR-1804
FM/MW/SW CASSETTE CAR STEREO
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TABLE OF CONTENTS
1.
GENERAL
Button Locations ............................................................. 3
Setting the Clock ............................................................. 3
Installation ....................................................................... 4
Connections ..................................................................... 4
2.
DISASSEMBLY ......................................................... 6
3.
MECHANICAL ADJUSTMENTS ....................... 10
4.
ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 10
Tuner Section .................................................................. 11
5.
DIAGRAMS
5-1. IC Pin Function Description ........................................... 14
5-2. Note for Printed Wriring Boards and
Schematic Diagrams ....................................................... 16
5-3. Printed Wiring Board Main Section ........................ 17
5-4. Schematic Diagram Main Section (1/2) ................... 19
5-5. Schematic Diagram Main Section (2/2) ................... 21
5-6. Printed Wiring Board PANEL Section .................... 23
5-7. Schematic Diagram PANEL Section ....................... 23
6.
EXPLODED VIEWS ................................................ 26
7.
ELECTRICAL PARTS LIST ............................... 32
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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SECTION 1
GENERAL
This section is extracted from
instruction manual.
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