SERVICE MANUAL
Model Name Using Similar Mechanism NEW
CD Mechanism Type
CDM19JB-DVBU4B
CDM19JN-DVBU4B
Base Unit Name
DVBU4B
Optical Pick-up Name
KHM-230AAA
SUPER AUDIO CD PLAYER
US Model
Canadian Model
AEP Model
SPECIFICATIONS
SCD-XA777ES
Ver 1.1 2001.10
9-873-192-02
Sony Corporation
2001J0500-1
Home Audio Company
C
2001.10
Published by Sony Engineering Corporation
(US and Canadian models)
When a super audio CD is played
Playing frequency range
2 Hz to 100 kHz
Frequency response
2 Hz to 50 kHz (3 dB)
Dynamic range
108 dB or more
Total harmonic distortion rate
0.0012 % or less
Wow and flutter
Value of measurable limit (
±0.001 %
W. PEAK) or less
When a CD is played
Frequency response
2 Hz to 20 kHz
Dynamic range
100 dB or more
Total harmonic distortion rate
0.0017 % or less
Wow and flutter
Value of measurable limit (
±0.001 %
W. PEAK) or less
Output connector
*Output only the audio signals of the CD
Laser radiant power:
5.47 uW at 650 nm
*These output is the value measured at a distance of about
200mm from the objective lens surface on the optical pick-up.
Power requirements
120 V AC, 60 Hz
230 V AC, 50/60 Hz (AEP model)
Power consumption
32 W
Dimensions (w/h/d)
430
× 130 × 380 mm
(17
× 5 1/8 × 15 in.)
incl. projecting parts
Mass (approx.)
16 kg (35 lbs 5 oz.)
Supplied accessories
Design and specifications are subject to change without notice.
ANALOG OUT
DIGITAL (CD)
OUT
OPTICAL*
DIGITAL (CD)
OUT
COAXIAL*
PHONES
Jack type
Phono
jacks
Square
optical
output
connector
Coaxial
output
connector
Stereo
phone jack
Output level
2 Vrms
(at 50 kilohms)
18 dBm
0.5 Vp-p
10 mW
Load impedance
Over 10 kilohms
Light emitting
wave length:
660 nm
75 ohms
32 ohms
(
)
· Audio connecting cord
phono jack
× 2 (Red and White) y phono jack × 2 (Red
and White) (3)
phono jack
× 1 (Black) y phono jack × 1 (Black) (2)
· Remote commander RM-SX700 (1)
· R06 (size-AA) batteries (2)
· AC power cord (Mains lead) (1)
General
Laser
Semiconductor laser
(SACD:
= 650 nm)
(CD:
= 780 nm)
Emission duration: continuous
2
SCD-XA777ES
TABLE OF CONTENTS
1.
SERVICING NOTES ............................................... 4
2.
GENERAL ................................................................... 9
3.
DISASSEMBLY
3-1. Disassembly flow ............................................................ 10
3-2. Case (Top) ....................................................................... 11
3-3. Loading Panel Assy ......................................................... 11
3-4. Front Panel Section ......................................................... 12
3-5. MAIN Board, Bracket (MAIN) ...................................... 12
3-6. Mechanism Deck (CDM19JB-DVBU4B/
CDM19JN-DVBU4B), RF Board ................................... 13
3-7. Disc Table, Belt, Loading Motor (M1) ........................... 13
3-8. Optical Pick-up (KHM-230AAA/J1NP) ........................ 14
3-9. Base Unit (DVBU4B) ..................................................... 15
4.
TEST MODE .............................................................. 16
5.
DIAGRAMS
5-1. Block Diagram RF/SERVO Section ........................ 31
5-2. Block Diagram MAIN Section (1/2) ....................... 32
5-3. Block Diagram MAIN Section (2/2) ....................... 33
5-4. Block Diagram AUDIO Section (1/2) ..................... 34
5-5. Block Diagram AUDIO Section (2/2) ..................... 35
5-6. Block Diagram
DISPLAY/POWER SUPPLY Section ...................... 36
5-7. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 37
5-8. Printed Wiring Boards
LOADING MOTOR/RF/SWITCH Boards .............. 38
5-9. Schematic Diagram
LOADING MOTOR/RF/SWITCH Boards .............. 39
5-10. Printed Wiring Board
MAIN Board (Component Side) .............................. 40
5-11. Printed Wiring Board
MAIN Board (Conductor Side) ................................ 41
5-12. Schematic Diagram MAIN Board (1/5) .................. 42
5-13. Schematic Diagram MAIN Board (2/5) .................. 43
5-14. Schematic Diagram MAIN Board (3/5) .................. 44
5-15. Schematic Diagram MAIN Board (4/5) .................. 45
5-16. Schematic Diagram MAIN Board (5/5) .................. 46
5-17. Printed Wiring Board D.OUT Board ....................... 47
5-18. Schematic Diagram D.OUT Board .......................... 47
5-19. Printed Wiring Board
MOTHER Board (Component Side) ........................ 48
5-20. Printed Wiring Board
MOTHER Board (Conductor Side) ......................... 49
5-21. Schematic Diagram MOTHER Board (1/2) ............ 50
5-22. Schematic Diagram MOTHER Board (2/2) ............ 51
5-23. Printed Wiring Board AUDIO FRONT Board ......... 52
5-24. Schematic Diagram AUDIO FRONT Board ........... 53
5-25. Printed Wiring Board AUDIO SURR Board ........... 54
5-26. Schematic Diagram AUDIO SURR Board .............. 55
5-27. Printed Wiring Board AUDIO C/SW Board ............ 56
5-28. Schematic Diagram AUDIO C/SW Board .............. 57
5-29. Printed Wiring Board PANEL Board ...................... 58
5-30. Schematic Diagram PANEL Board ......................... 59
5-31. Printed Wiring Boards
HP/JOG/KEY/R.CNTL Boards ................................ 60
5-32. Schematic Diagram
HP/JOG/KEY/R.CNTL Boards ................................ 61
5-33. Printed Wiring Board A-POWER Board ................. 62
5-34. Schematic Diagram A-POWER Board .................... 63
5-35. Printed Wiring Board D-POWER Board ................. 64
5-36. Schematic Diagram D-POWER Board ................... 65
5-37. Printed Wiring Boards AC/AC SW Boards ............. 66
5-38. Schematic Diagram AC/AC SW Boards ................. 67
5-39. IC Pin Function Description ........................................... 76
6.
EXPLODED VIEWS
6-1. Case Section .................................................................... 91
6-2. Front Panel Section ......................................................... 92
6-3. Bottom Section ................................................................ 93
6-4. Board Section-1 ............................................................... 94
6-5. Board Section-2 ............................................................... 95
6-6. Chassis Section ............................................................... 96
6-7. Mechanism Deck Section
(CDM19JB-DVBU4B, CDM19JN-DVBU4B) .............. 97
6-8. Base Unit Section (DVBU4B) ........................................ 98
7.
ELECTRICAL PARTS LIST ............................... 99
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
3
SCD-XA777ES
Notes on chip component replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C dur-
ing repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
This appliance is classified as a CLASS 1
LASER product.
The CLASS 1 LASER PRODUCT
MARKING is located on the rear exterior.
The following caution label is located
inside the unit.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, "metallized" knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a VOM
or battery-operated AC voltmeter. The "limit" indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2 V AC range are suitable. (See Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15
µF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
This label is located on the left exterior.
US and Canadian models
AEP model
4
SCD-XA777ES
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
CLEANING OF OPTICAL PICK-UP LENS
In cleaning the lens of optical pick-up, use the air blower.
Never use a cotton swab for cleaning the lens of optical pick-up,
which otherwise causes a trouble.
RESETTING OPERATION AT POWER ON
If the power is turned on with a disc loaded in the set, a sequence
of operation as shown below will be performed.
(The operation varies depending on the type of disc)
Condition: continue mode
(1) CD
1.
Sled reverse move (sled in)
2.
Disc detect
3.
IC setting for CD
4.
Servo error signal offset auto adjustment
5.
Spindle kick for LD on
6.
LD on
7.
Focus search
8.
Focus servo on
9.
Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment
12. Tracking & sled servo on
13. Focus bias auto adjustment
14. Focus servo gain auto adjustment
15. Tracking servo gain auto adjustment
16. Jump to lead-in area
17. Read TOC
18. Stop
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
(2) SACD (single layer)
1.
Sled reverse move (sled in)
2.
Disc detect
3.
IC setting for SACD
4.
Servo error signal offset auto adjustment
5.
Spindle kick for LD on
6.
LD on
7.
Focus search
8.
Focus servo on
9.
Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment
12. Tracking & sled servo on
13. Focus bias auto adjustment
14. Focus servo gain auto adjustment
15. Tracking servo gain auto adjustment
16. Jump to lead-in area
17. Read TOC
18. Stop
(3) SACD (dual layer)
1.
Sled reverse move (sled in)
2.
Disc detect
3.
IC setting for SACD
4.
Servo error signal offset auto adjustment
5.
Spindle kick for LD on
6.
LD on
7.
Focus search
8.
Focus servo on (layer 0)
9.
Spindle kick
10. Spindle servo on
11. E-F balance auto adjustment (layer 0)
12. Tracking & sled servo on (layer 0)
13. Focus bias auto adjustment (layer 0)
14. Focus servo gain auto adjustment (layer 0)
15. Tracking servo gain auto adjustment (layer 0)
16. Jump to lead-in area
17. Read TOC
18. Focus jump (layer 0tlayer 1)
19. E-F balance auto adjustment (layer 1)
20. Tracking & sled servo on (layer 1)
21. Focus bias auto adjustment (layer 1)
22. Focus servo gain auto adjustment (layer 1)
23. Tracking servo gain auto adjustment (layer 1)
24. Focus Jump (layer 1tlayer 0)
25. Stop
Part No.
MODEL IDENTIFICATION
Back Panel
Model
Part No.
US and Canadian
4-235-601-1[]
AEP
4-235-601-2[]
5
SCD-XA777ES
HOW TO OPEN THE DISC TABLE WHEN POWER SWITCH TURNS OFF
OPTICAL PICK-UP SERVICE POSITION
Place the insulator on the MAIN board, then install the base unit (DVBU4B) on it as shown in the figure.
disc table
loading panel assy
tapering driver
cover (CAM)
2
Draw out the loading panel assy
in the direction of arrow B.
1
Insert a tapering driver in the hole
at the bottom of the unit,
turn the cover (CAM) fully in the
direction of arrow A.
B
A
base unit
(DVBU4B)
MAIN board
insulator