surface of objective lens
slide base
2-axis actuator
2-axis cover
cotton swabs
objective lens
optical pick-up
SERVICE MANUAL
SCD-333A
COMPACT DISC MECHANISM
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTE
Flexible Circuit Board Repairing
· Keep the temperature of the soldering iron around 270 °C
during repairing.
· Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
· Be careful not to apply force on the conductor when soldering
or unsoldering
Notes on Chip Component Replacement
· Never reuse a disconnected chip component.
· Notice that the minus side of a tantalum capacitor may be
damaged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
Laser Diode Properties
· Material: GaAlAs
· Wavelength: 780 nm
· Emission Duration: continuous
· Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm from
the objective lens surfase on the Optical Pick-up Block.
NOTES ON CLEANING THE OBJECTIVE LENS
Notes:
Do not force to push the objective lens. Otherwise, the plate spring
supporting the objective lens will be bent, causing a deteriorated
RF waveform.
Never touch anything other than the objective lens. Otherwise, a
significant deterioration occurs in the RF waveform.
Apply CD lens cleaner B-4 (Part No.:J-2501-000-A) to cotton swabs
(narrow type) (Part No.:J-2501-023-A) to be lightly wet. Use a force
(about 5 g (0.18 oz)) to make the objective lens in contact with the
bottom lightly, and clean the lens by spirals as following below.
Replace the cotton swab and repeat this cleaning two or three times.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
2
2
1-1. PRINTED WIRING BOARDS
SCD-333A
1
F
E
D
C
B
A
23
7
456
MD-MAIN BOARD (SIDE A)
1-660-771-
21
04
M903
(LOADING)
RED
WHT
M41
M21
M38
M10
M51
M58
M52
M28
M27
M76
M06
M75
M74
M35
M67
M66
M71
M63
TP025
TP029
TP027
TP028
M70
TP042
TP032
TP011
TP013
TP016
TP014
TP012
TP010
TP009
TP019
TP004
TP006
TP007
TP005
TP002
TP001
TP033
TP036
TP037
TP038 TP034
TP023
TP041
TP073
TP046
BR002
TP053
TP043
TP039
TP052
BR001
TP047
TP044
TP045
TP049
TP051
TP055
TP050
TP072
TP067
TP069
TP068
TP065
TP066
TP070
TP071
TP054
TP061
TP062
TP059
TP058
TP064
TP063
TP057
TP056
TP026
TP040
M61
M69
M80
M02
M19
M39
M22
M25
M26
TP017
M24
TP022
M23
M16
M17
M15
M11
M07
M29
TP008
TP015
TP003
SECTION 1
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
for printed wiring boards:
· X : parts extracted from the component side.
· Y : parts extracted from the conductor side.
·
z
: Through hole.
· b : Pattern from the side which enables seeing.
(The other layer's patterns are not indicated.)
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A)
parts face are indicated.
for schematic diagram:
· All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
· All resistors are in
and 1/4 W or less unless otherwise
specified.
·
%
: indicates tolerance.
·
f
: internal component.
· U : B+ Line.
· Signal path.
J
: CD
33
1
F
E
D
C
B
A
2
3
74
5
6
80
61
R604
R605
R607
R620
R621
C621
C620
64
65
IC601
R611
R609
R610
R612
R407
C405
C404
C403
R404
R405
R403
Q603
R548
R591
R592
R594
R595
R550
C602
R406
R408
R606R402
R590
C610
C591
C590
R593
L601
28
1
6
Q401
Q590
C532
R507
R504
C507
R510
C505
C504
C506
R503
Q502
1
MD-MAIN BOARD (SIDE B)
C303
R602
D601
C627
R601
L301
C210
X601
X301
41
24
25
40
C630
125
13
14
CN104
1
14
15
IC401
C402
R512
R546
R502
R501
R506
R401
C401
R511
L503
C554
C411
C410
Q501
C514
R508
R509
R514C512
C509
R513
R543
C508
R518
C510
R541
R515 R542
R517
C511
C513
R520
C553
R544
C530
1
12
36
25
13
24
48
37
IC501
Q504
R505
R547
R545
CN103
116
C503
R523
C515
R521
R522
R519
C517
C516
Q503
C552
R525
R529
R528
R526
R524
C518
C521
C519
C520
R527
C555
C522
C502
R540
L502
C526
R532
R534
C523
R533
C525
R530
R531
R538
C527
C556
R535
R537
R536
C524
R539 C528
L501
CN102
Q601
C529
C501
7
1
Q602
Q302
C624
C623
C622
C302
C304
R301
C305
C611
C310
1
24
1
13
12
C628
C301Q301
C626
C625
C101
L602
L201
L101
C110
10
C629
R630
C601
C201
CN101
20
D630
DISC IN
DETECT
DISC IN
DETECT
D631
R631
R608
R603
R632
D401
D632
LOADING
COMPLETION
DETECT
LIMIT SW
BOARD
MOTOR FLEXIBLE BOARD
PICK-UP FLEXIBLE BOARD
SW620
(LIMIT)
1-660-772-
1-660-769-
1-660-770-
OPTICAL
PICK-UP
KSS-520A
11
11
13
M902
(SLED)
M901
(SPINDLE)
1-660-771-
21
7
1 BLK
RED
DISC IN SW BOARD
Q621
DISC IN
DETECT
WHT
PNK/WHT
BLK/WHT
ORG/WHT
BLU/WHT
WHT
PNK/WHT
SW621
(DISC IN)
1-660-773-
13
BLK/WHT
ORG/WHT
BLU/WHT
R620
R622
R621
SENSOR BOARD
Q620
DISC IN
DETECT
Q623
LOADING
COMPLETION
DETECT
1-660-775-
13
SW602
(CHAKING DET)
04
IC402
119
20
32
64
52
33
51
IC301
IC502
SCD-333A
Ref. No.
Location
D401
A-7
D601
A-5
D630
A-1
D631
C-3
D632
A-7
IC301
B-3
IC401
F-6
IC402
D-7
IC501
E-2
IC502
D-3
IC601
B-6
Q301
B-2
Q302
B-2
Q401
E-7
Q501
F-4
Q502
E-4
Q503
F-1
Q504
F-3
Q590
C-4
Q601
C-1
Q602
B-2
Q603
C-6
· Semiconductor
Location
4
4
1-2. SCHEMATIC DIAGRAM
SCD-333A
(Page
5)
55
SCD-333A
(Page
4)