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9-872-004-11
PCG-XG9 (UC)
Sony Corporation
Information Technologies Company
Notebook Computer
9-872-004-11
PCG-XG9
(UC)
9-872-004-11
99J1605-1
PCG-XG9
SERVICE MANUAL
US Model
Canadian Model
English
99J1605-1
Printed in U.S.A.
© 1999. 10
Published by VAIO Customer Link Division (Japan)
S400


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­ 2 ­
PCG-XG9 (UC)
Information in this document is subject to change without
notice.
Sony and VAIO are trademarks of Sony. Intel logo and Intel
Inside logo are registered trademarks of Intel Corporation.
Pentium MMX is a trademark of Intel Corporation. Microsoft,
MS-DOS, Windows, the Windows 95 and Windows 98 logo
are trademarks of Microsoft Corporation.
All other trademarks are trademarks or registered trademarks
of their respective owners. Other trademarks and trade names
may be used in this document to refer to the entitles claiming
the marks and names or their produces. Sony Corporation
disclaims any proprietary interest in trademarks and trade names
other than its own.
Service and Inspection Precautions
1. Obey
precautionary
markings
and
instructions
Labels and stamps on the cabinet, chassis, and components identify
areas requiring special precautions. Be sure to observe these
precautions, as well as all precautions listed in the operating manual
and other associated documents.
2. Use designated parts only
The set's components possess important safety characteristics, such
as noncombustibility and the ability to tolerate large voltages. Be
sure that replacement parts possess the same safety characteristics as
the originals.
Also remember that the
! mark, which appears in
circuit diagrams and parts lists, denotes components that have
particularly important safety functions; be extra sure to use only the
designated components.
3. Always follow the original design when
mounting parts and routing wires
The original layout includes various safety features, such as inclusion
of insulating materials (tubes and tape) and the mounting of parts
above the printer board. In addition, internal wiring has been routed
and clamped so as to keep it away from hot or high-voltage parts.
When mounting parts or routing wires, therefore, be sure to duplicate
the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components,
and wiring have been returned to their original condition. Also check
the area around the repair location to ensure that repair work has caused
no damage, and confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negative side of
tantalum capacitors is easily damaged by heat.
6. When handling flexible print boards...
· The temperature of the soldering-iron tip should be about 270C.
· Do not apply the tip more than three times to the same pattern.
· Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
Caution Markings for Lithium/Ion Battery - The following or
similar texts shall be provided on battery pack of equipment or
in both the operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly
replaced. Replace only with the same or equivalent type
recommended by the manufacturer. Discard used batteries
according to the manufacturer's instructions.
CAUTION: The battery pack used in this device may present a
fire or chemical burn hazard if mistreated. Do not disassemble,
heat above 100
°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
! SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.


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TABLE OF CONTENTS
SECTION 1
CHAPTER 1. OPERATION
1-1. VAIO Notebook Computer User Guide ........................... 1-1
(to 1-60)
SECTION 2
CHAPTER 1. REMOVAL
1-1. Flowchart ......................................................................... 1-1
1-2. Main Electrical Parts Location Diagram ......................... 1-1
1-3. Removal ........................................................................... 1-2
1. Hinge Cover ..................................................................... 1-2
2. Keyboard Unit ................................................................. 1-2
3. HDD Assy ........................................................................ 1-3
4. Flap Assy, Flap Base Plate ............................................... 1-3
5. Palm Rest Housing Assy .................................................. 1-4
6. Display Assy .................................................................... 1-4
7. MBX-25 Assy (1) ............................................................ 1-5
8. Speaker Assy, Lithium Battery,
CNX-75 Board, ANL-17 Board ....................................... 1-5
9. MBX-25 Assy (2) ............................................................ 1-6
10. Flash Panel, Bezel Housing Assy .................................... 1-7
11. LCD Unit, Inverter Assy, LCD Cable .............................. 1-8
(to 1-8)
CHAPTER 2. SELF DIAGNOSTICS
2-1. Required Tools and Peripheral Devices ........................... 2-1
2-2. Tools and Peripheral Device Connection ......................... 2-3
2-3. How to Start the Diagnostics ........................................... 2-4
2-4. Test Items ......................................................................... 2-4
1. Start Menu ....................................................................... 2-4
2. PCG-X Series Diagnostics
(Tests performed from DOS) ........................................... 2-4
3. PCG-X Series Diagnostics
(Performed from Windows) ............................................. 2-5
4. Contens of Tests (Tests performed from DOS) ................ 2-5
5. Contens of Test (Performed from Windows) ................... 2-8
2-5. About the PASSWORD Bypass ...................................... 2-8
(to 2-8)
CHAPTER 3. BLOCK DIAGRAM ............................... 3-1
(to 3-2)
CHAPTER 4. FRAME HARNESS DIAGRAM ........ 4-1
(to 4-2)
CHAPTER 5. EXPLODED VIEWS AND
PARTS LIST ............................................ 5-1
5-1. Main Section .................................................................... 5-2
5-2. LCD Section .................................................................... 5-5
(to 5-6)
Section
Title
Page
·
Abbreviations
UC : US model / Canadian model
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PCG-XG9 (UC)


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1-1
PCG-XG9 (UC)
CHAPTER 1.
SECTION 1
OPERATION
1-1. VAIO Notebook Computer User Guide