SONY MZDH10P - Service Manual Immediate Download

SERVICE MANUAL

PORTABLE MD PLAYER

MZ-DH10P

Ver. 1.2 2005.05

SPECIFICATIONS

9-879-552-03

2005E05-1

Sony Corporation

Personal Communications Business Division

Published by Sony Engineering Corporation

US and foreign patents licensed from Dolby Laboratories.

Model Name Using Similar Mechanism

NEW

MD Mechanism Type

MT-MZDH10P-181

Optical Pick-up Name

ABX-UJ

US Model

AEP Model

UK Model

Chinese Model

Tourist Model

· SonicStage is trademark or registered trademark of Sony Corporation.

·MD Simple Burner, OpenMG, "MagicGate", "MagicGate Memory Stick", "Memory Stick", Hi-MD, Net

MD, ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks of Sony Corporation.

· Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of Microsoft

Corporation in the United States and /or other countries.

· IBM and PC/AT are registered trademarks of International Business Machines Corporation.

·Macintosh is a trademark of Apple Computer, Inc. in the United States and/ or other countries.

·Pentium is a trademark or registered trademark of Intel Corporation.

· All other trademarks and registered trademarks are trademarks or registered trademarks of their respective

holders.

·TM and ® marks are omitted in this manual.

following U.S. Patents: #5,987,525; #6,061,680; #6,154,773, #6,161,132, #6,230,192, #6,230,207, #6,240,459,

#6,330,593, and other patents issued or pending. Services supplied and/or device manufactured under license

for following Open Globe, Inc. United States Patent 6,304,523.

Gracenote is a registered trademarks of Gracenote. The Gracenote logo and logotype, and the "Powered by

Gracenote" logo are trademarks of Gracenote.

MZ-DH10P

Supplied Accessories

AC power adaptor

Remote control 1)

USB cradle

Earphones

Dedicated USB cable2)

LIP-4WM Lithium-ion rechargeable battery

Rechargeable battery case

Carrying pouch

Ferrite core (for the remote cord, AEP and UK models only)

CD-ROM3) (SonicStage/MD Simple Burner)

Operating Instructions

1) For US model, remote control with a ferrite core is supplied.

2) For Chinese and Tourist models, the ferrite core is not attached to the dedicated USB cable.

3) Do not play a CD-ROM on an audio CD player.

Ver. 1.2

120V AC, 60Hz (US model)

220V AC, 50Hz (Chinese model)

MZ-DH10P

TABLE OF CONTENTS

SERVICING NOTES ............................................... 4

GENERAL ................................................................... 5

DISASSEMBLY

3-1.

Disassembly Flow ...........................................................

3-2.

Panel (Bottom) Block ......................................................

3-3.

Camera Module ...............................................................

3-4.

MAIN Board ....................................................................

3-5.

Panel (Upper) Block ........................................................

3-6.

Ornamental Belt ..............................................................

3-7.

Mechanism Deck (MT-MZDH10P-181),

Battery Case ....................................................................

3-8.

Gear (SA), Gear (SB) ...................................................... 10

3-9.

OP Service Assy .............................................................. 10

3-10. DC Motor SSM18D/C-NP (Spindle) (M701),

DC Motor SSM21A/C-NP (Sled) (M702),

DC Motor Unit (Over Write Head Up/Down) (M703) ... 11

3-11. Holder Assy ..................................................................... 11

3-12. Position Of Ferrite Core .................................................. 12

TEST MODE .............................................................. 13

ELECTRICAL ADJUSTMENTS .......................... 17

DIAGRAMS

6-1.

Block Diagram MD SERVO Section ........................ 21

6-2.

Block Diagram AUDIO/CAMERA Section .............. 22

6-3.

Block Diagram POWER SUPPLY Section ............... 23

6-4.

Schematic Diagram MAIN Board (1/9) .................... 25

6-5.

Schematic Diagram MAIN Board (2/9) .................... 26

6-6.

Schematic Diagram MAIN Board (3/9) .................... 27

6-7.

Schematic Diagram MAIN Board (4/9) .................... 28

6-8.

Schematic Diagram MAIN Board (5/9) .................... 29

6-9.

Schematic Diagram MAIN Board (6/9) .................... 30

6-10. Schematic Diagram MAIN Board (7/9) .................... 31

6-11. Schematic Diagram MAIN Board (8/9) .................... 32

6-12. Schematic Diagram MAIN Board (9/9) .................... 33

6-13. Printed Wiring Board

MAIN Board (Component Side) ............................... 34

6-14. Printed Wiring Board

MAIN Board (Conductor Side) ................................. 35

6-15. Printed Wiring Boards PANEL Section ..................... 36

6-16. Schematic Diagram PANEL Section ......................... 37

EXPLODED VIEWS

7-1.

Overall Section ................................................................ 51

7-2.

Panel (Upper) Section ..................................................... 52

7-3.

Chassis Section ................................................................ 53

7-4.

Mechanism Deck Section (MT-MZDH10P-181) ............ 54

ELECTRICAL PARTS LIST ................................ 55

Notes on chip component replacement

· Never reuse a disconnected chip component.

· Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Flexible Circuit Board Repairing

· Keep the temperature of the soldering iron around 270 °C

during repairing.

· Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

· Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION

Use of controls or adjustments or performance of procedures

other than those specified herein may result in hazardous radiation

exposure.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE

WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE

PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR

IN SUPPLEMENTS PUBLISHED BY SONY.

Ver. 1.2

MZ-DH10P

SECTION 1

SERVICING NOTES

The laser diode in the optical pick-up block may suffer electrostatic

break-down because of the potential difference generated by the

charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also

use the procedure in the printed matter which is included in the

repair parts.

The flexible board is easily damaged and should be handled with

care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on

the disc reflective surface by the objective lens in the optical pick-

up block. Therefore, when checking the laser diode emission,

observe from more than 30 cm away from the objective lens.

NOTES ON HANDLING THE OPTICAL PICK-UP

BLOCK OR BASE UNIT

OPERATION CHECK WHEN THE MAIN BOARD IS

REMOVED

In making an operation check with the MAIN board removed from

the set, short the SL894 of the MAIN board with the solder before

starting the operation check.

Note: Be sure to remove the solder used for shortcircuit after the repaire

completed.

MAIN BOARD (Conductor Side)

SL894

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead-

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

· Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

· Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges

occur such as on IC pins, etc.

· Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

Providing the required system environment

The following system environment is required in order to use the SonicStage Ver. 3.0/MD

Simple Burner Ver. 2.0 software for the MD Walkman.

This software is not supported by the following environments:

· OSs other than the indicated above

· Personally constructed PCs or operating systems

· An environment that is an upgrade of the original manufacturer-installed operating system

· Multi-boot environment

· Multi-monitor environment

· Macintosh

· We do not ensure trouble-free operation on all computers that satisfy the system requirements.

· The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard

(factory) settings.

· For Windows 2000 Professional users, install Service Pack 3 or later version before using the

software.

· We do not ensure trouble-free operation of the system suspend, sleep, or hibernation function on all

computers.

System requirements

Computer

IBM PC/AT or Compatible

·CPU: Pentium III 450 MHz or higher

·Hard disk drive space: 200 MB or more (1.5 GB or more is

recommended) (The amount space will vary according to Windows

version and the number of music files stored on the hard disk.)

·RAM: 128 MB or more

Others

·CD drive (capable of digital playback by WDM) (A CD-R/RW drive

is necessary for CD writing)

·Sound Board

·USB port

Operating

System

Factory installed:

Windows XP Media Center Edition 2005/Windows XP Media Center

Edition 2004/Windows XP Media Center Edition/Windows XP

Professional/Windows XP Home Edition/Windows 2000 Professional/

Windows Millennium Edition/Windows 98 Second Edition

Display

High Color (16bit) or higher, 800

600 dots or better (1024

768 dots

or better is recommended)

Others

· Internet access: for Web registration, EMD services and CDDB

·Windows Media Player (version 7.0 or higher) installed for playing

WMA files

Notes

NOTES ON REPLACEMENT OF CSP (CHIP SIZE

PACKAGE) IC

Replacement of MM1690LCBE (IC401), SN761059AZQLR

(IC501), SC901585VAR2 (IC601), CXD2683-225GG (IC801) and

S29PL032J55BFI120A (IC802) used in this set requires a special

tool.

MZ-DH10P

SECTION 2

GENERAL

This section is extracted from

instruction manual.