ORDER NO.
PIONEER CORPORATION 4-1, Meguro 1-chome, Meguro-ku, Tokyo 153-8654, Japan
PIONEER ELECTRONICS (USA) INC. P.O. Box 1760, Long Beach, CA 90801-1760, U.S.A.
PIONEER EUROPE NV Haven 1087, Keetberglaan 1, 9120 Melsele, Belgium
PIONEER ELECTRONICS ASIACENTRE PTE. LTD. 253 Alexandra Road, #04-01, Singapore 159936
PIONEER CORPORATION 2006
AVIC-D8000/XU/CN5
CRT3641
DVD NAVIGATION
AVIC-D8000
/XU/CN5
This service manual should be used together with the following manual(s):
Model No.
Order No.
Mech.Module
Remarks
CX-3016
CRT3056
MS3
DVD Mech. Module:Circuit Description, Mech. Description, Disassembly
For details, refer to "Important Check Points for Good Servicing".
K-ZZW. MAR. 2006 Printed in Japan
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SAFETY INFORMATION
1. Safety Precautions for those who Service this Unit.
· Follow the adjustment steps in the service manual when servicing this unit. When check -
ing or adjusting the emitting power of the laser diode exercise caution in order to get safe, reliable results.
Caution:
1.
2. During repair or tests, do not view laser beam for 10 seconds or longer.
CAUTION
This service manual is intended for qualified service technicians; it is not meant for the casual do-it-yourselfer.
Qualified technicians have the necessary test equipment and tools, and have been trained to properly and safely repair
performed
can adversely affect the
and reliability of the product and may void the
.
If you are not qualified to
the repair of this product properly and
, you should not risk trying to do so
and refer the repair to a qualified service technician.
WARNING!
The AEL (accessible emission level )of the laser power output is less than CLASS 1
but the laser component is capable of emitting radiation exceeding the limit for
CLASS 1.
A specially instructed person should do servicing operation of the apparatus.
Laser diode characteristics
Wave length:
DVD:640~660nm
CD:770~810nm
DVD : 2.48mW(Emitting period :9sec.)
CD : 705 W(Emitting period : unlimited)
Additionla Laser Caution
Transistors Q1101 and Q1102 in PCB drive the laser diodes for DVD and CD
respectively. When Q1101 or Q1102 is shorted between their terminals,
the laser diodes for DVD or CD will radiate beam. If the top cover is removed
with no disc loaded while such short-circuit is continued, the naked eyes may
be exposed to the laser beam.
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DVD MECHANISM MODULE section precaution
1. EJECT LOCK MODE for DVD mechanism
In order to enter "EJECT LOCK" mode, reset start while pressing the "ATT" and "
" keys together.
Pressing the "ATT" and "
" keys until monitor backlight is turned on.
In order to exit "EJECT LOCK" mode, follow the same steps to enter this mode.
2. Before disassembling the unit, be sure to turn off the power. Unplugging and plugging the connectors
during power-on mode may damage the ICs inside the unit.
3. To protect the pickup unit from electrostatic discharge during servicing, take an appropriate treatment
(shorting-solder) by referring to "the DISASSEMBLY" .
4. After replacing the pickup unit, be sure to skew adjustment.
- Service Precautions
1. You should conform to the regulations governing the product (safety, radio and noise, and other regulations),
and should keep the safety during servicing by following the safety instructions described in this manual.
2. A positioning jig is required for incorporating DSP unit.
3. Take care upon its operation as the transistor heat rank in the Audio Unit becomes heated.
4. Take good care of its handling as the generation of high voltage at the inverter part may cause an electric
shock during its operation.
5. When conducting touch panel inspection, use something thin and round at the end like a touch-pen.
Also, take care not to add excessive force on the touch panel.
6. The OSD IC is not provided in this product. Use OSD-indicated jig when adjusting monitor part.
is a trademark of DVD Format/Logo Licensing Corporation.
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[Important Check Points for Good Servicing]
In this manual, procedures that must be performed during repairs are marked with the below symbol.
Please be sure to confirm and follow these procedures.
1. Product safety
Please conform to product regulations (such as safety and radiation regulations), and maintain a safe servicing environment by
following the safety instructions described in this manual.
1 Use specified parts for repair.
Use genuine parts. Be sure to use important parts for safety.
2 Do not perform modifications without proper instructions.
Please follow the specified safety methods when modification(addition/change of parts) is required due to interferences such as
radio/TV interference and foreign noise.
3 Make sure the soldering of repaired locations is properly performed.
When you solder while repairing, please be sure that there are no cold solder and other debris.
Soldering should be finished with the proper quantity. (Refer to the example)
4 Make sure the screws are tightly fastened.
Please be sure that all screws are fastened, and that there are no loose screws.
5 Make sure each connectors are correctly inserted.
Please be sure that all connectors are inserted, and that there are no imperfect insertion.
6 Make sure the wiring cables are set to their original state.
Please replace the wiring and cables to the original state after repairs.
In addition, be sure that there are no pinched wires, etc.
7 Make sure screws and soldering scraps do not remain inside the product.
Please check that neither solder debris nor screws remain inside the product.
8 There should be no semi-broken wires, scratches, melting, etc. on the coating of the power cord.
Damaged power cords may lead to fire accidents, so please be sure that there are no damages.
If you find a damaged power cord, please exchange it with a suitable one.
9 There should be no spark traces or similar marks on the power plug.
When spark traces or similar marks are found on the power supply plug, please check the connection and advise on secure
connections and suitable usage. Please exchange the power cord if necessary.
0 Safe environment should be secured during servicing.
When you perform repairs, please pay attention to static electricity, furniture, household articles, etc. in order to prevent injuries.
Please pay attention to your surroundings and repair safely.
2. Adjustments
To keep the original performance of the products, optimum adjustments and confirmation of characteristics within specification.
Adjustments should be performed in accordance with the procedures/instructions described in this manual.
4. Cleaning
For parts that require cleaning, such as optical pickups, tape deck heads, lenses and mirrors used in projection monitors, proper
cleaning should be performed to restore their performances.
3. Lubricants, Glues, and Replacement parts
Use grease and adhesives that are equal to the specified substance.
Make sure the proper amount is applied.
5. Shipping mode and Shipping screws
To protect products from damages or failures during transit, the shipping mode should be set or the shipping screws should be
installed before shipment. Please be sure to follow this method especially if it is specified in this manual.
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CONTENTS
SAFETY INFORMATION......................................................................................................................................2
1. SPECIFICATIONS .............................................................................................................................................6
2. EXPLODED VIEWS AND PARTS LIST.............................................................................................................8
2.1 PACKING ....................................................................................................................................................8
2.2 EXTERIOR (1) ..........................................................................................................................................10
2.3 EXTERIOR (2) ..........................................................................................................................................12
2.4 EXTERIOR (3) ..........................................................................................................................................14
2.5 DVD MECHANISM MODULE ...................................................................................................................16
3. BLOCK DIAGRAM AND SCHEMATIC DIAGRAM ..........................................................................................18
3.1 BLOCK DIAGRAM ....................................................................................................................................18
3.2 OVERALL CONNECTION DIAGRAM ......................................................................................................38
3.3 CC UNIT (CPU, ASIC, SDRAM)(GUIDE PAGE).......................................................................................40
3.4 CC UNIT (ROM, SRAM, BUS-BUFFER) ..................................................................................................46
3.5 CC UNIT (GRAPHIC)(GUIDE PAGE) .......................................................................................................48
3.6 CC UNIT (NAND I/F) ................................................................................................................................54
3.7 CC UNIT (DSP, I/F CONNECTOR)(GUIDE PAGE) ..................................................................................56
3.8 CC UNIT (CC POWER SUPPLY) .............................................................................................................62
3.9 NAND UNIT ..............................................................................................................................................64
3.10 AUDIO UNIT(GUIDE PAGE) ...................................................................................................................66
3.11 DVD CORE UNIT(MS3)(SO-DC)(GUIDE PAGE)....................................................................................72
3.12 DVD CORE UNIT(MS3)(CPU)(GUIDE PAGE)........................................................................................78
3.13 COMPOUND UNIT(A) AND COMPOUND UNIT(B) ...............................................................................86
3.14 PU UNIT(REFERENCE).........................................................................................................................87
3.15 NAVI MOTHER PCB (SYSCOM, PS)(GUIDE PAGE).............................................................................88
3.16 NAVI MOTHER PCB(NAVI AV, EXTERNAL I/F)(GUIDE PAGE).............................................................94
3.17 GPS UNIT(GUIDE PAGE) ....................................................................................................................100
3.18 MONITOR PCB(GUIDE PAGE) ............................................................................................................106
3.19 KEYBOARD PCB .................................................................................................................................114
3.20 PANEL PCB ..........................................................................................................................................116
3.21 DSP UNIT(GUIDE PAGE).....................................................................................................................118
3.22 CONNECTOR PCB ..............................................................................................................................124
4. PCB CONNECTION DIAGRAM ....................................................................................................................126
4.1 CC UNIT .................................................................................................................................................126
4.2 AUDIO UNIT ...........................................................................................................................................130
4.3 DVD CORE UNIT(MS3)..........................................................................................................................134
4.4 COMPOUND UNIT(A) AND COMPOUND UNIT (B) ..............................................................................138
4.5 NAND UNIT ............................................................................................................................................139
4.6 NAVI MOTHER PCB...............................................................................................................................140
4.7 GPS UNIT...............................................................................................................................................144
4.8 PANEL PCB ............................................................................................................................................145
4.9 MONITOR PCB ......................................................................................................................................146
4.10 KEYBOARD PCB .................................................................................................................................150
4.11 DSP UNIT .............................................................................................................................................152
4.12 CONNECTOR PCB ..............................................................................................................................154
5. ELECTRICAL PARTS LIST ...........................................................................................................................155
6. ADJUSTMENT ..............................................................................................................................................185
6.1 JIG CONNECTION DIAGRAM ...............................................................................................................185
6.2 DVD ADJUSTMENT ...............................................................................................................................186
6.3 MONITOR PCB ADJUSTMENT .............................................................................................................206
6.4 TEST MODE ...........................................................................................................................................215
6.5 USING THE TEST DISC.........................................................................................................................239
7. GENERAL INFORMATION ...........................................................................................................................252
7.1 DIAGNOSIS ............................................................................................................................................252
7.1.1 DISASSEMBLY....................................................................................................................................252
7.1.2 PCB LOCATIONS ................................................................................................................................259
7.1.3 CONNECTOR FUNCTION DESCRIPTION ........................................................................................260
7.2 IC ............................................................................................................................................................261
7.3 OPERATIONAL FLOW CHART ..............................................................................................................289
8. OPERATIONS ...............................................................................................................................................290